Description
The AirPrime HL Series is designed to be flexible, providing manufacturers with the choice of soldering down the module for efficient high-volume production, or using an innovative snap-in socket.
With the snap-in socket, device manufacturers can quickly place the module in the device any time in the production cycle and swap 2G modules for 3G or 4G modules in the future, even in completed and field-deployed devices. The snap-in socket enables manufacturers to leverage one design for their 2G, 3G, and 4G deployments, simply by changing the module installed in production – no other changes to the device design would be required.
Key Features
- Interchange 2G, 3G or 4G modules with ease
- Temperature range –40°C to 85°C
